Automated Test Systems & Module Packaging
Secure Modules. Controlled Production.
The performance of a secure credential starts with the module inside it. Hengbao brings together module packaging and automated testing to support the production of contact, contactless and dual-interface modules for secure physical technologies.
A Connected Production Process
Module production needs consistent handling from wafer preparation to final packing. Each assembly stage affects the next, while testing provides the information needed to assess the finished module.
Hengbao connects die attach, wire bonding, encapsulation and module separation with electrical and functional screening. A coordinated workflow helps customers bring module requirements into production with a clear approach to assembly and quality control.
Explore Our Solutions
Module Packaging
Bring secure chips into module formats for contact, contactless and dual-interface applications. Explore assembly stages from die attach and wire bonding to protective encapsulation, module separation and reel packing.
Module Testing & Quality Assurance
Connect automated electrical and functional testing with module sorting and production quality screening. Process monitoring and quality records support a clearer view of manufacturing conditions and results.
From Wafer Preparation to Packed Modules
The production workflow covers wafer and substrate-tape preparation, die attach, wire bonding, resin encapsulation, module separation, testing and reel packing. Testing and sorting connect the assembly process with the final handling of modules for dispatch.
Supporting Secure Physical Technologies
Payment Cards
Module packaging for secure payment-card programmes, including contact, contactless and dual-interface formats.
Telecommunications and Connectivity
Assembly and testing requirements for secure connectivity modules, with production discussions shaped around the intended SIM or related credential application.
Identity and Authentication
Secure-module requirements for identity credentials and authentication applications that depend on controlled assembly and dependable quality screening.
A Controlled Manufacturing Approach
Assembly and Testing Together
A coordinated production sequence connects chip placement and interconnect bonding with encapsulation, separation and final screening.
Production Environment
The manufacturing approach incorporates ESD controls and monitoring of temperature and humidity across production areas, helping teams manage the conditions surrounding sensitive components.
Capacity Development
A phased expansion programme is designed to increase automated packaging capacity. Future plans include a dedicated coupling-module line and space for additional secure-product applications.
Discuss Your Next Module Programme
Speak with Hengbao about your module format, application and production requirements. We can explore how packaging and testing fit the needs of your programme.
Discuss Your Module Requirements