Module Packaging
Precision Assembly for Secure Chip Modules
Secure chips need a module structure that connects them to the physical credential and protects them during handling. Hengbao supports module packaging through a coordinated process spanning chip placement, interconnect bonding, encapsulation and final packing.
Packaging Around the Module Application
Different credential programmes place different demands on module structure, assembly and handling. The packaging approach needs to connect the chip and substrate with the requirements of the finished application.
Hengbao brings the core production stages into one workflow, with electrical and functional screening following assembly. Customers can discuss the module format, chip and substrate requirements, expected volumes and downstream handling as part of the production scope.
Contact, Contactless & Dual-Interface Modules
Support secure credential programmes across contact, contactless and dual-interface module formats. Packaging connects the semiconductor die with the module structure used in the intended card or credential application.
Payment and telecommunications programmes can draw on a shared assembly foundation while retaining the module requirements of the specific application.
- Contact-module packaging
- Contactless-module packaging
- Dual-interface module packaging
Module Formats
Contact
ISO 7816 contact interface for chip-and-PIN and chip-and-signature card programmes.
Contactless
RF antenna coupling for tap-to-pay and contactless credential applications.
Dual-Interface
Combined contact and contactless capability within a single module structure.
Die Attach & Wire Bonding
Die attach places the chip onto the prepared substrate. Wire bonding then forms the electrical interconnections between the chip and module contact structure.
High-precision placement and ultrasonic wire bonding form the assembly foundation for subsequent encapsulation. Coordinating these stages helps maintain a consistent process as modules move through production.
- Wafer and substrate-tape preparation
- High-precision chip placement
- Ultrasonic wire interconnect bonding
Encapsulation & Module Singulation
Protect the assembled chip and wire interconnections through resin encapsulation. The encapsulation stage prepares the assembly for the handling and separation steps that follow.
Precision punching separates modules from the production tape before electrical and functional screening. This links protective packaging with the final module format and testing workflow.
- Resin encapsulation and chip protection
- Precision punching and module separation
- Transfer to testing and sorting
Stage sequence
Reel Packing & Production Support
Reel packing prepares tested modules for subsequent handling and dispatch. The packing stage follows assembly, separation and quality screening within the production workflow.
Production planning connects the module application and volume requirements with the relevant assembly and packing stages. Controlled handling remains important as modules move from production into the next part of the customer's supply chain.
- Packing following module testing and screening
- Reel preparation for handling and dispatch
- Coordination across assembly, testing and packing
Production flow
Planned expansion
Coupling Module Development
A dedicated coupling-module packaging line is planned as part of the production expansion programme. The proposed scope focuses on inductive coupling modules for dual-interface bank-card antenna connections.
Hengbao welcomes discussions around future coupling-module requirements, helping shape the production configuration and development priorities around customer programmes.
The Module Production Journey
Materials preparation
Prepare wafer and substrate tape for assembly.
Die attach
Place the chip onto the substrate.
Wire bonding
Form the electrical interconnections.
Encapsulation
Protect the chip and bonds with resin.
Module separation
Punch and separate the modules.
Testing
Carry out electrical and functional screening.
Packing
Prepare reels for handling and dispatch.
Plan Your Module Packaging Programme
Share the module format, intended application and production requirements. Hengbao can discuss an assembly and testing approach that fits your programme.
Discuss Module Packaging